
OMRON VT-X700-E / -L Power Supplies / In Addition
last update: January 06, 2016
The cross-sectional images of relevant inspection targets can be easily selected from abundant camera-image libraries to ensure precise fault detection.
Inspection of large-thickness PCBs and power devices is possible by combining a proprietary CT structuring technology with a high-output X-ray source.
Compatible with large-sized PCBs such as those used by network base stations.
World's highest CT speed* thanks to our patent-approved technologies.
New imaging system reduced inspection tact times by 10% compared with conventional systems.
Enabled the complete inspection of all components
(almost impossible by visible light-based inspection).
* Based on an internal research conducted in January 2015.
last update: January 06, 2016
If you have just landed here, this product OMRON VT-X700-E / -L Power Supplies / In Addition,Power Supplies / In Addition is offered online by Tianin FLD Technical Co.,Ltd. This is an online store providing Power Supplies / In Addition at wholesale prices for consumers. You can call us or send enquiry, we would give you the prices, packing,deliverty and more detailed information on the VT-X700-E / -L We cooperate with DHL,TNT,FEDEX,UPS,EMS,etc.They guarantee to meet your needs in terms of time and money,even if you need your OMRON VT-X700-E / -LPower Supplies / In Addition tomorrow morning (aka overnight or next day air) on your desk, 2, 3 days or more.Note to international customers, YES, we ship worldwide.
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| Catalog Name | Catalog Number [size] | Last Update | |
|---|---|---|---|
| | Q327-E1-04 [1471KB] | May 09, 201620160509 | VT-X700-E / -L Catalog |
last update: September 24, 2012
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last update: September 24, 2012
last update: January 06, 2016
| Item | Description | ||
|---|---|---|---|
| Model | VT-X700-E | VT-X700-L | |
| Inspected components | BGA/CSP, inserted components, SOP, QFP, transistors, R/C chips, bottom-side terminal components, QFN, Power devices | ||
| Inspected items | Openings, non-wet, solder amount, shifting, foreign object stuck, bridging, lead presence, etc. (selectable to suit detected item) | ||
| Imaging specifications | Imaging method | 3D-slice imaging using parallel CT | |
| Resolution | 10, 15, 20, 25 or 30 μm (selectable to suit detected item) | ||
| X-ray source | Micro-focus closed tube (130 kV) | ||
| X-ray detector | Flat panel detector | ||
| Inspected PCBs | Size | M-size PCB (50 mm x 50 mm to 330 mm x 255 mm); thickness: 0.4 mm to 3.0 mm | PCB (50 mm x 50 mm to 610 mm x 610 mm); thickness: 0.6 mm to 7.0 mm |
| Weight | 2.0 kg or lighter (with components mounted) | 12.0 kg or lighter (with components mounted) | |
| Mounted component height | Top: 50 mm or shorter; bottom: 20 mm or shorter | ||
| Warpage/Flexure | 2.0 mm or less | 3.0 mm or less | |
| Device specifications | Dimensions | 1,550(W) x 1,650(D) x 1,620(H)mm | 2,180 (W) x 2,500 (D) x 1,720 (H) mm |
| Weight | Approx. 2,920 kg | Approx. 5,250 kg | |
| PCB transfer height | 900±15 mm | ||
| Power supply voltage | Single phase, 200/210/220/230/240 VAC (± 10%), 50/60 Hz | 3 phase, 200/210/220/230/240 VAC, 380/405/415/440 VAC (± 10%), 50/60 Hz | |
| Rated power | 3.1 kVA | 4.7 kVA | |
| X-ray leakage | Less than 0.5 μSv/h | ||
last update: January 06, 2016
last update: March 02, 2015
last update: March 02, 2015